Telecommunications: An Industry in the Midst of Transformation

Sponsored by: Pentair/Schroff

As more vendors in the datacom market adopt Open Compute Project (OCP) specifications, more opportunities are opened for OCP technology to be adopted by the telecommunication industry. System operators are looking to minimize costs, and while existing OCP designs offer a variety of cost and performance benefits, the telecom industry has unique requirements that require tailored solutions. This white paper focuses on different types of next generation OCP solutions for the telecommunication sector that strategically address this growing need.

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Future-proofed Data Center Cooling with Air-to-water Heat Exchanger

Sponsored by: Pentair/Schroff

As the need for information is increasing, so is the need for increased processing power of IT equipment, resulting in increasingly higher processor densities and heat levels. Elevated temperatures result in equipment failure, and ultimately, costly network downtime, making the need for efficient cooling systems more important than ever. This white paper focuses on solutions and applications geared toward maximizing the lifespan and effectiveness of your data center through air-to-water cooling solutions.

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Identifying the Ideal Mechanical PCB Hardware for Electronic Systems

Sponsored by: Pentair/Schroff

With today’s diverse electronic systems applications, a variety of Printed Circuit Board (PCB) hardware and retainer solutions may be deployed to address a broad range of unique protection requirements. This white paper discusses the different types of PCB hardware solutions and their applications –– ranging from general electronic systems requiring basic board retention and placement to complex high-tension, clamping force applications found in high shock and vibration environments, such as industrial and transportation applications.

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